Request InfoSUSS MicroTec Inc.WATERBURY CENTER, Vt., July 24, 2006 -- Suss MicroTec, a supplier of precision manufacturing and test equipment to the semiconductor industry, has introduced M-Lock, a wafer-bonding system designed for high vacuum applications. In what the company said is an industry-first, this field-upgradeable, load-locked wafer-bonding system was developed by Suss MicroTec for advanced MEMS (microelectromechanical systems) devices that require ultraclean, low moisture and low contamination vacuum bonding. In addition, M-Lock is well suited for MEMS devices with on-chip getters, such as silicon gyros and other advanced MEMS products, the...See full productRelated content from Photonics MediaPRODUCTSPhotonics Spectra December 2023 IssueMEMS Autofocus ActuatorThe MEMS Autofocus Actuator for Active Athermalization in Embedded Vision Cameras from Sheba Microsystems Inc. was made to be used in automotive, action, drones, machine vision, security and...Photonics.com 4/2/2024Flow Cell and Reflection StrobeThe ATR Flow Cell and near infrared diffuse reflection probe (shown) from tec5USA Inc. are 3-A certified and can be used for applications including spectroscopic analysis for food, feed, and...Photonics.com 4/27/2022Longwave IR CamerasThe Ceres V 640 and Ceres V 1280 from Xenics BV are high-performance, longwave IR cameras that expand thermal imaging, sensing, and thermographic applications. 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