Request InfoMaster Bond Inc.A two-component room-temperature-curing epoxy adhesive, sealant and coating has been developed by Master Bond Inc. The EP21HT polymer system offers a 1:1 mix ratio by weight or volume. It is 100% reactive, contains no solvents or volatile substances and has a service operating temperature range of –60 to 400 °F. Physically strong, the adhesive bonds well to similar and dissimilar substrates, including glass, wood, metal, ceramic, rubber and plastic. Once cured, it offers electrical insulation properties, and it can withstand exposure to thermal cycling and various chemicals, including water,...See full productRelated content from Photonics MediaARTICLESPhotonics Spectra April 2024 IssueA Quantum Leap for Sensitive Gas AnalysisFar above an oil pipeline, a drone bobs and weaves. 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