Close

Search

Search Menu
Photonics Media Photonics Buyers' Guide Photonics EDU Photonics Spectra BioPhotonics EuroPhotonics Industrial Photonics Photonics Showcase Photonics ProdSpec Photonics Handbook
More News
share
Email Facebook Twitter Google+ LinkedIn

SUBMICRON BONDER

Photonics Spectra
Apr 2007
FinetechRequest Info
 
Finetech Inc. has released the Opto-Bonder Femto, its latest device for the assembly of optoelectronic components and modules. The bonder can handle various assembly technologies, including power laser and laser bar binding, flip chip and VCSEL bonding, MEMS and MOEMS, and sensors. It features high accuracy of ±0.5 μm in a small footprint of 1270 × 900 mm. New features include a 25% larger table, motorized X-Y-Z and theta movements, and a substrate with a diameter up to 6 in. with automatic pattern recognition. Bonding processes are automatically controlled and require no operator intervention during the alignment and bonding procedure.


REQUEST INFO ABOUT THIS PRODUCT

* Message:
(requirements, questions for supplier)
Your contact information
* First Name:
* Last Name:
* Email Address:
* Company:
Address:
Address 2:
City:
State/Province:
Postal Code:
* Country:
Phone #:
Fax #:

Register or login to auto-populate this form:
Login Register
* Required
Photonics Buyers' Guide
Looking for MEMS? There are 20 companies listed in the Photonics Buyers' Guide.
Browse Cameras & Imaging, Lasers, Optical Components, Test & Measurement, and more.
Finetech Inc.New ProductsOpto-Bonder Femtooptoelectronic componentsSensors & Detectors

Terms & Conditions Privacy Policy About Us Contact Us
back to top

Facebook Twitter Instagram LinkedIn YouTube RSS
©2017 Photonics Media
x Subscribe to Photonics Spectra magazine - FREE!
X
Are you interested in this product?
If you'd like Finetech to reach out to you with more information about this product, please supply your email and they will contact you.

Email Address:
Stop showing me this for the remainder of my visit