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PV Series Laser-Scribing Machines

Photonics.com
Apr 2007
IPG Photonics, Microsystems Div.Request Info
 
MANCHESTER, N.H., April 5, 2007 -- JP Sercel Associates (JPSA), a maker of laser systems for wafer processing and micromachining, has introduced a line of industrial laser scribing systems to meet the requirements of silicon wafer photovoltaic cell manufacturing.

Built on the ChromaDice diode-pumped solid-state (DPSS) laser platform, the Class 1-enclosed laser scribing systems systems are designed for the isolation and series interconnection of thin-film solar cells. They employ high peak power, short-pulsed DPSS laser sources to remove a wide variety of thin films from large glass, metal or polymer substrates. A number of wavelengths suitable for different layer materials are available, including 1064, 532, 355 and 266 nm.

The company said the systems used advanced laser technology scribing to rapidly and accurately produce fine scribed lines with >30MO-hm isolation. Applications include the following:
  • P1 front contact -- transparent conducting oxides (TCOs) such as ITO, IZO, SnO2 and ZnO2 can be scribed using 1064 nm;
  • P2 semiconductor -- amorphous silicon (a-Si), cadmium telluride (CdTe), and copper indium gallium diselenide (CIS or CIGS) can be scribed using 532 or 1064 nm;
  • P3 back contacts -- metals such as Al, Mo or Au can be scribed using 532 or 1064 nm;
  • Border deletion -- bulk deletion of all three layers to provide an edge isolation border may be achieved using high-power 1064-nm lasers.
JPSA PV-series workstations are modular and scalable to accommodate glass sheet sizes, currently up to 1300 x 1300 mm. Panel throughput or Takt time (the maximum allowable time in order to meet demand) on a single tool can be matched to the overall production requirement by adding more laser power.

In process, large sheets are mounted horizontally, aligned automatically and processed in orthogonal directions. One axis is a traveling optics gantry with multiple scribing beams mounted below the glass. The laser beam(s) transmit through the glass to the scribing layer, allowing debris extraction from the top and auto handling of the panel on the uncoated side. The other motion axis is the glass itself, which is stepped through the machine in the other direction. Panel loading can be automatic from a conveyor, or manual according to manufacturing requirements.

For more information, visit: www.jpsalaser.com

JPSA
220 Hackett Hill Road
Manchester, NH 03102
Phone: (603) 518-3200
Fax: (603) 518-3298


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biophotonicsenergyindustrialJ P SercelJ.P. SercelJP SercelJPSAnanophotonicsPhotonics Spectraphotovoltaic cellsProductsPVthin-filmwafer scribing

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