Apr 2007HORIBA ScientificRequest Info
Horiba Jobin Yvon announces the release of its new LEM interferometer for in-situ etch rate monitoring and end-point detection.
The LEM replaces the Sofie DigiLem. With its new compact design and enhanced image quality, the LEM can be mounted on any process chamber with a direct top view of the wafer. It provides a real-time digital CCD image of the sample surface, making its 30-m laser beam positioning simple and accurate. Based on interferometry technique, the LEM provide in-situ etch/growth rate monitoring for endpoint detection of a wide range of dry etch applications.
Depending on the configuration selected, the LEM can provide a simple analog signal output for analysis with an external software, or can be delivered with our state-of-the-art APC software --Sigma-P -- for accurate etch rate, trench depth and process statistical calculations. By using simply a TTL trigger and our optional pattern recognition software, the LEM can be easily interfaced to any process chamber for an operator-free process monitoring and end-point detection.