DIRECT AND MASK WRITING
Jun 2007Vistec Electron Beam GmbHRequest Info
Vistec Electron Beam GmbH has launched the SB250 electron beam lithography system for direct and midrange mask writing applications. The system operates in the standard writing modes of variable shaped beam, write-on-the-fly principle and vector scan, and in two optional modes, flexible stage speed and multipass. With automatic substrate handling and a 210 × 210-mm2 stage travel range, the system takes masks up to 7 in. and wafers up to 200 mm. Additional features include a 200-mm platform, a 50-kV high-precision shaped-beam column and up to 20 A/cm2 of current density.