Request InfoAlbis Optoelectronics AGGaAs photodiode arrays that support the QSFP standard have been released by Albis Optoelectronics AG. The standard defines an integrated four-channel optical transceiver that provides increased port density when replacing four standard SFP transceiver modules in Ethernet, Fiber Channel and Infiniband applications. The photodiodes provide bandwidth of 5 Gb/s per channel, and each optical aperture has a 100-μm diameter, facilitating optical alignment. Capacitance is 400 fF at bias voltages of 3 V. The chips are designed for wire bonding as well as for flip-chip soldering. Eight- and...See full productRelated content from Photonics MediaWEBINARSPhotonics.com 5/10/2023InGaAs Photodiode Detectors: Packaging, Performance, and SWIR ApplicationsVince Forte of Marktech Optoelectronics reviews InGaAs detector types, packaging, performance characteristics, and applications in the NIR and SWIR wavelength bands. He focuses particularly on photo...Photonics.com 10/27/2021Fiber Optic Solutions for Medical DevicesSteve Allen provides a brief overview and examples of procedures that continue to push adoption and proliferation of optical fiber-based medical devices. From cosmetic surgery to cutting-edge sensing...Photonics.com 3/7/2019In Vivo Medical Laser Procedures: An OverviewThis webinar, presented by OFS, will provide an overview of current in vivo medical procedures performed using lasers and optical fibers. The presentation will begin with a brief history of...Photonics.com 1/12/2023A Proven, Portable, and PIC-Based Methodology for Cultivating a Next-Generation WorkforceWith the passage of the CHIPS and Science Act and growing demand for photonic integrated circuit technology, the semiconductor industry is once again gaining momentum. But even as the U.S. rebuilds...PHOTONICS DICTIONARY+ TERMSPhotonics Dictionarydie bondingDie bonding is a critical process in semiconductor manufacturing and microelectronics assembly, where a semiconductor die or chip is attached and electrically connected to a substrate or a package....PHOTONICS BUYERS' GUIDE CATEGORIESWire Bonding EquipmentPhotonics Integrated Component Manufacturing Equipment