Nov 2007Veeco Instruments Inc.Request Info
The Wyko SP9900 surface-profiling system from Veeco Instruments Inc. performs measurements that support high yield and device reliability for high-density interconnect packages. The optical metrology system for semiconductor packaging inspection monitors parameters in multilayer organic panels manufactured for flip-chip pin-grid-array and ball-grid-array packages. Extending the capabilities of the Wyko SP family, it delivers faster measurements, increased sample access and the ability to measure panel sizes up to 600 × 600 mm, all with the same footprint as previous devices. Measurements include critical dimensions, trace heights, via depths, roughness of layers in laminate packages and the analysis of solder bump arrays.