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SUBMOUNTS

Photonics Spectra
Jan 2008
Remtec Inc.Request Info
 
For high-power laser diodes, submounts with 25- to 75-μm-thick copper metallization and Zero Pullback from a burr-free ceramic edge have been unveiled by Remtec Inc. Submount materials include BeO with thermal conductivity from 280 to 325 W/mK and AlN from 170 to 230 W/mK. The submounts are based on plated copper on thick- and thin-film technology, which combines elements of thick and thin films with plated copper and nickel/gold finish. This produces both silver thick-film and TiW thin-film seed layers of various thicknesses, plated copper from 5 to 75 μm and Ni-Au finish with gold thickness from 0.1 to 2.5 μm.


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