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THERMOELECTRIC MODULE

Photonics Spectra
Mar 2008
Nextreme Thermal Solutions Inc.Request Info
 
NextremeThermalSolutions.jpgNextreme Thermal Solutions Inc.’s ultrahigh packing fraction OptoCooler module is optimized for laser diode, LED and advanced sensor products. With a footprint of 0.55 mm2, the cooler removes 420 mW and pumps heat density up to 78 W/cm2 at 25 °C ambient. At 85 °C, the device removes 610 mW and pumps heat density up to 112 W/cm2. It features thin-film thermal bump technology, millisecond response time and broad temperature range capabilities.


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