Request InfoFINETECH GmbH & Co. KGFinetech GmbH & Co. KG has expanded its Fineplacer product line with the introduction of the Fineplacer Femto, an automated submicron bonder for assembly of optoelectronic components. It can be used to assemble and bond laser bars and diodes, flip chips, VCSELs, MEMS, sensors, micro-optics, surface-mount photonics and simple die attach. The 1270 × 900-mm system exhibits accuracy of ±5 μm. Features include a large working area, and automatic pattern recognition and alignment based on motorized X, Y, Z and theta movements. Processes are automatically controlled and do not require...See full productRelated content from Photonics MediaPRODUCTSVision-Spectra.com March 2023 IssueAI Detection and Tracking SoftwareEnhanced Prism™ AI detection and tracking software from Teledyne FLIR improves inference performance for perception development. 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