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Photonics Spectra
Apr 2008
SCHOTT North America Inc., Advanced OpticsRequest Info
Designed for optoelectronics applications, the AF 32 glass introduced by Schott North America Inc. is suitable for use in the wafer-level chip scale packaging and optics markets. Its coefficient of thermal expansion matches that of silicon, helping to prevent warp during the manufacture of complex assemblies and during reflow, when a wafer-level chip scale packaging imager is attached to a printed circuit board. Thicknesses range from 0.1 to 1.1 mm, and the fire-polished surface of the glass achieves a roughness value below 1 nm rms, eliminating the need for fine mechanical polishing. AF 32 is an aluminoborosilicate glass that is alkali-free in synthesis and is easy to cut and dice. The company says that it exhibits high luminous transmittance and good cosmetic qualities.


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New Productsoptoelectronics applicationsSchott North America Inc.wafer-level chip scale packaging

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