Apr 2008Nextreme Thermal Solutions Inc.Request Info
Nextreme Thermal Solutions Inc. has unveiled the microscale ultrahigh packing fraction OptoCooler module for cooling and temperature control requirements in optoelectronic and medical applications. The device removes a maximum of 420 mW of heat at a 25 °C ambient temperature in an active footprint of 0.55 mm2. As a result, the module can pump a heat density up to 78 W/cm2. At 85 °C, these values increase to 610 mW and 112 W/cm2, respectively. The instrument can be integrated directly into electronic and optoelectronic packaging.