Request InfoMaster Bond Inc.A two-component epoxy adhesive/sealant for cryogenic applications has been released by Master Bond Inc. The EP29LPSP compound withstands temperatures as low as 4 K and resists cryogenic shocks, such as a drop from room temperature to liquid helium temperatures in a 5- to 10-min period. The optically clear substance has a mix ratio of 100:65 by weight. Although it cures at room temperature, optimal results are achieved if it is heat-cured at 130 to 165 °F. It bonds well to a variety of substances, including metals, glass, ceramics and plastics. When curing, it has a low exotherm. Its mixed...See full productRelated content from Photonics MediaPRODUCTSPhotonics.com 1/15/2024Compact Motorized Rotary StagesThe AY110-40 series from Optimal Engineering Systems Inc. are compact rotary stages for microscopy, laser positioning and machining, inspection, assembly, and testing applications. 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