Jul 2008Laird TechnologiesRequest Info
For Use as a Thermal Interface MaterialST. LOUIS, July 29, 2008 – Laird Technologies has added the T-flex 700 for use as a thermal interface material to its T-flex gap filler line.
The next generation thermal pad increases the thermal conductivity of the line to 5.0 W/mK. The material is highly compliant and allows for thinner interfaces and overall improved thermal performance measured by total thermal resistance. It is naturally adhesive for ease of handling and assembly.
Thickness ranges available include 1 to 5 mm in 0.25 mm increments, and it is available in standard sheets or die cut parts that can be custom made to specification. Another option available is adhesive on only one side.
It is suitable for applications where the tolerance stack-up is high and the maximum mechanical stress on the components must be low. The high-performance solution is also available to mechanical design engineers working on a range of electronic devices, including notebook and desktop computers, servers, wireless base stations and radio heads, LED lighting, LCD and PDP televisions and general applications employing heat pipes, heat sinks or thermal modules.
For more information, visit: www.lairdtech.com
16401 Swingley Ridge Road
Chesterfield, MO 63017
Phone: (636) 898-6000
Fax: (636) 898-6100