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Rapidly Curing Epoxy

Photonics.com
Aug 2008
Master Bond Inc.Request Info
 
HACKENSACK, N.J., August 1, 2008 – Master Bond Inc., has introduced a new high performance, low viscosity epoxy adhesive called EP41SMED for fast, room temperature curing, bonding applications. Master-Bond.jpg

This compound has a 5 to 1 mix ratio by weight and has a handling time of as little as 10-15 minutes at ambient temperatures.

Bonds are resistant to water, oil, and many organic solvents, as well as cold sterilants, ETO and gamma radiation. This product fully meets USP Class VI requirements and conforms to Title 21, US Code of Federal Regulations, FDA Chapter 1, Section 175.105 & 175.300 for food applications.

Master Bond EP41SMED contains no solvents or diluents. It has exceptionally low shrinkage upon cure. Bonds are rigid and adhere to a wide variety of similar and dissimilar substrates, including metals, glass, ceramics, rubbers, wood and most plastics.

EP41SMED is easy to apply and is available for use in pint, quart, gallon and 5 gallon container kits. It has a shelf life in original unopened containers of 6 months minimum.


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bondingbondscuringfda chapter 1Master BondphotonicsProductsrapidly curing epoxysection 175.105 & 175.300 Ep41smedTitle 21us code of federal regulationsUSP Class VI

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