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Light-Curing Adhesive
Dec 2008
Master Bond Inc.Request Info
HACKENSACK, N.J., Dec. 29, 2008 – Master Bond Inc. has unveiled the UV10FL-1 UV cure adhesive manufactured with a high strength profile and the ability to cure in thick sections.

Master-Bond-UV10FL1.jpgThe adhesive’s bond strength is equal to or exceeds those obtained from conventional room temperature curing epoxy compositions, according to the company. It offers a tensile strength of 2850 psi, a tensile modulus of 154,000 psi and it remains flexible with an elongation at a break of 43 percent.

Suitable as a casting compound, it is a low viscosity liquid adhesive and can be cured in a range of section thicknesses. Castings up to ¼-in. thick can be prepared.

It does not require complete cure by the UV source and it exhibits high heat resistance for service up to 150 °C. It delivers a high bond strength obtained with metals, ceramics, glass, many plastics and elastomers. It provides fatigue resistance and performs well under stress in adverse environments.

For more information, visit:

Master Bond Inc.
154 Hobart Street
Hackensack, NJ  07601
Phone: (201) 343-8983
Fax: (201) 343-2132


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Common name for a variety of adhesives used for lens bonding, fiber optic splicing and other photonics applications. The term is actually a prefix denoting the presence of an epoxide group in a molecule.
The technology of generating and harnessing light and other forms of radiant energy whose quantum unit is the photon. The science includes light emission, transmission, deflection, amplification and detection by optical components and instruments, lasers and other light sources, fiber optics, electro-optical instrumentation, related hardware and electronics, and sophisticated systems. The range of applications of photonics extends from energy generation to detection to communications and...
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