Apr 2009CRAIC TechnologiesRequest Info
Film microspectrophotometerSAN DIMAS, Calif., April 21, 2009 – Craic Technologies Inc. has unveiled the QDI 2010 Film microspectrophotometer, designed for rapid noncontact and nondestructive measurement of the thickness of thin films of submicron sampling areas. It analyzes films of many materials on both transparent and opaque substrates and enables the user to determine thin film thickness on semiconductors, microelectromechanical systems devices, disk drives and flat panel displays. With proprietary contamination imaging capabilities, the instrument is designed specifically for industrial processes.
The system combines advanced microspectroscopy with sophisticated QDI FilmPro software to enable the user to measure film thickness by either transmission or reflectance of many types of materials and substrates. Sampling areas can range from more than 100 to less than 1 µm. Designed for the production environment, it incorporates a number of easily modified processing recipes, data analysis tools and the ability to create new film recipes. The capability for direct imaging and analysis of films with ultraviolet microscopy also can be added to this instrument.
Spectra and images can be taken from the deep-UV to the near-IR, and microspectra and images can be acquired in absorbance, reflectance, polarization and fluorescence. The integrated thermoelectrically cooled array detector provides low noise and long-term stability.
Applications include organic LEDs, flat panel color masks, semiconductor film thickness and optical components.
For more information, visit: www.microspectra.com
Craic Technologies Inc.
948 N. Amelia Ave.
San Dimas, CA 91773
Phone: (310) 573-8180
Fax: (310) 573-8182