Close

Search

Search Menu
Photonics Media Photonics Buyers' Guide Photonics EDU Photonics Spectra BioPhotonics EuroPhotonics Industrial Photonics Photonics Showcase Photonics ProdSpec Photonics Handbook
More News
share
Email Facebook Twitter Google+ LinkedIn

FAST-CURING ADHESIVE

Photonics Spectra
Mar 1997
Master Bond Inc.Request Info
 
Master Bond Inc. has developed a two-part, silver-filled, electrically conductive adhesive that cures rapidly at room temperature. The Model EP77M-F compound has a one-to-one mix ratio and can set up in ambient temperatures within 5 to 7 min, even when mixed in very small amounts. It features a high bond strength of 1500 psi tensile shear when fully cured at room temperature. The adhesive does not contain any diluents or solvents, and bonds are resistant to oil, water and most organic solvents.


REQUEST INFO ABOUT THIS PRODUCT

* Message:
(requirements, questions for supplier)
Your contact information
* First Name:
* Last Name:
* Email Address:
* Company:
Address:
Address 2:
City:
State/Province:
Postal Code:
* Country:
Phone #:
Fax #:

Register or login to auto-populate this form:
Login Register
* Required
materialsNew Products

Terms & Conditions Privacy Policy About Us Contact Us
back to top

Facebook Twitter Instagram LinkedIn YouTube RSS
©2017 Photonics Media
x Subscribe to Photonics Spectra magazine - FREE!
X
Are you interested in this product?
If you'd like Master Bond Inc. to reach out to you with more information about this product, please supply your email and they will contact you.

Email Address:
Stop showing me this for the remainder of my visit