Mar 1997Master Bond Inc.Request Info
Master Bond Inc. has developed a two-part, silver-filled, electrically
conductive adhesive that cures rapidly at room temperature. The Model
EP77M-F compound has a one-to-one mix ratio and can set up in ambient
temperatures within 5 to 7 min, even when mixed in very small amounts.
It features a high bond strength of 1500 psi tensile shear when fully cured
at room temperature. The adhesive does not contain any diluents or solvents,
and bonds are resistant to oil, water and most organic solvents.