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EP30M3LV Epoxy System

Photonics.com
Sep 2009
Master Bond Inc.Request Info
 
Low-Exothermic Potting Compound
HACKENSACK, N.J., Sept. 16, 2009 – Master Bond Inc.’s EP30M3LV polymer is a low-exothermic two-component epoxy system formulated to help avoid excess heat buildup and damage to thermally sensitive components during chemical-resistant casting and potting operations. Part “A” is black, and part “B” is amber, with other colors available.

MasterbondPottingCompound.jpgThe compound contains an air release additive to remove air bubbles. It cures at room temperatures or more rapidly at elevated temperatures, and it can be cured in various cross-section thicknesses.

It has good electrical insulation properties, a 2:1 mix ratio by weight and a low mixed viscosity of 2000 to 3000 cycles/s. It adheres well to similar and dissimilar substrates. Cured castings can resist exposure to various chemicals and thermal cycling up to 250 °F. The compound has a service operating temperature range of -60 to 250 °F and offers good dimensional stability. Flexural strength is 14,000 lb/sq in., and tensile strength is >8000 lb/sq in.

Environmentally friendly and 100% reactive, the compound contains no solvents or diluents. It is available for use in half-pint, pint, quart, gallon and 5-gallon pail kits. Applications include the electronics, electrical, computer, construction, appliance, metalworking, automotive and chemical industries.


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100% reactiveair release additiveappliancesautomotivecasting and potting operationschemicalscomputersconstructionelectrical industryelectronics industryelevated temperaturesenvironmentally friendlyEP30M3LVepoxy systemlow-exothermicMaster Bondmetalworkingno diluentsno solventsphotonicsphotonics.compolymer systemProductsroom temperaturetwo-component

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