Feb 2010Coherent Kaiserslautern GmbHRequest Info
KAISERSLAUTERN, Germany, Feb. 9, 2010 – With the introduction of its Blaze series, Lumera Laser GmbH offers high-performance nanosecond lasers. Thanks to patented SpotLock pumping technology, they produce good beam characteristics, even at high average power and repetition rates, and high beam-pointing stability for precise machining of various materials.
The pumping technology minimizes thermal effects in the laser crystal that can negatively affect the performance and stability of high-power laser systems. It enables the spot size and corresponding focal position to remain constant over the entire repetition range. When changing the process parameters, no adjustments outside of the beam source need be made, thus avoiding costly set-up times.
Available in 1064- and 532-nm wavelengths, the lasers deliver a pulse duration of <60 ns at 100 kHz, a >100:1 horizontal polarization ratio and >90% beam circularity. The 1064-nm models have a pulse repetition frequency from 40 to 200 kHz and pulse-to-pulse energy stability of <3% rms. Beam divergence, full angle, is <0.6 mrad. The 532-nm models have a pulse repetition frequency from 80 to 180 kHz and pulse-to-pulse energy stability of <5%. Beam divergence, full angle, is <0.3 mrad. All produce a TEM00 beam with M2 <1.3.
For processing of materials that exhibit poor absorption in the infrared spectrum, the company provides a frequency-doubled version.
Particularly at low repetition rates, the Blaze-HE produces pulses with ultrahigh energy.
The Blaze-LP long-pulse version is a high-power laser that meets the requirements of the solar industry. Specifically, in emitter wrap-through solar cell technology, the contacts are moved to the back of the modules, such that the contacts do not shade the solar cell, increasing the efficiency by one third. According to the company, for this application conventional laser systems produce only 3000 to 5000 holes per second, but because of its longer pulses, the Blaze-LP drills more than 10,000 per second, with maximum precision at a wafer thickness of 120 µm.
All lasers in the series can operate in three modes to optimize the process parameters for each application. In the E-Max mode, they operate at maximum pulse energy. The E-Lock mode generates pulses with constant energy, regardless of the repetition rate and starting with the first pulse. This enables drilling of holes at defined intervals during the acceleration and deceleration phases of a scanner. In the E-Free mode, the operator can choose the energy of each pulse. Through these degrees of freedom, the laser can be optimized quickly for any specific application.
The various models in the series offer customized solutions for all high-precision materials machining.