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ULTRATHIN SUBSTRATES

Photonics Spectra
Mar 1997
Valley Design Corp., HeadquartersRequest Info
 
Valley Design Corp. has developed ultrathin silicon and GaAs wafers with precision-lapped, polished or chemically etched circuitries. Wafers as thin as 10 µm may be obtained. The company specializes in tight thickness specifications and fine polishing.


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