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Tlam SS LLD PCB Substrate

Photonics.com
Apr 2010
Laird TechnologiesRequest Info
 
ST. LOUIS, April 19, 2010 — Laird Technologies Inc. has released the enhanced Tlam SS LLD for use as a thermally conductive printed circuit board (PCB) substrate.

The versatile, thermally enhanced PCB substrate system is designed for heat dissipation in bright and ultrabright LED module applications. The thermally conductive PCB substrate provides eight to10 times the heat dissipation as compared to conventional FR4-based PCBs, a key ability in keeping components cool.

A copper circuit layer and aluminum or copper base plate are bonded together with a low-loss dielectric, which is essential to the high-performance of the PCB substrate. The dielectric can fit, and is processed through, standard FR4 print-and-etch operations without various parameter modifications. These dielectrics provide electrical isolation, thermal transfer and an adhesion layer for the substrate.

The substrate improves thermal transference from the heat source to the heat sink through PCBs, reducing the thermal stress placed on the PCB. These improvements benefit the LED market by providing a higher performing, lower cost thermal interface that extends operational life to the LED apparatus.

The boards are processed through standard pick-and-place surface mount technology and manual wire bond operations. Standard constructions are made with 1- or 2-oz copper and 1- or 1.5-mm-thick aluminum, grade 5052; 1- or 1.6-mm-thick aluminum, grade 6061; with a copper base available.

For more information, visit www.lairdtech.com


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