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Spectrogon US - Optical Filters 2024 LB

Tlam SS LLD PCB Substrate

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Laird Technologies
ST. LOUIS, April 19, 2010 — Laird Technologies Inc. has released the enhanced Tlam SS LLD for use as a thermally conductive printed circuit board (PCB) substrate. The versatile, thermally enhanced PCB substrate system is designed for heat dissipation in bright and ultrabright LED module applications. The thermally conductive PCB substrate provides eight to10 times the heat dissipation as compared to conventional FR4-based PCBs, a key ability in keeping components cool. A copper circuit layer and aluminum or copper base plate are bonded together with a low-loss dielectric, which is essential to the...See full product

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