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COB Ceramic Assemblies

Photonics.com
May 2010
Marktech OptoelectronicsRequest Info
 
LATHAM, N.Y., May 17, 2010 — Marktech Optoelectronics has expanded its product offerings with the introduction of custom COB (chip-on-board) ceramic LED assemblies and arrays for high-temperature and high-reliability applications.

The "chip-on-ceramic" LEDs and LED arrays offer manufacturers and integrators high-efficiency ceramic LED components across a full range of color temperatures.

The LEDs are available in configurations from four to hundreds of chips in series or parallel, as well as series/parallel combinations. The company has also expanded its full service integration and production capabilities and can produce a range of chip-on-ceramic and integrated light engines/modules in volume to support the needs of the medical and military industries.

The advantages of chip-on-board assembly are that more functions can be put into the same amount of space to achieve miniaturization of volume and weight.

Other benefits include lower cost, shorter production periods, good reliability and shorter signal interconnections for improved signal performance.

The devices can withstand thermal shock test, pulse test and mechanical test of at least a 27-kg load. Wire bond or printed circuit board layout can be easily changed to meet customer requirements.



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