Request InfoMaster Bond Inc.Master Bond Inc.’s EP21FL is a two-part epoxy resin system that features low to moderate viscosity. It is suitable for potting, coating and sealing electronic assemblies and for bonding dissimilar substrates with different coefficients of expansion. Typical viscosity of Part A (clear) is 4000 cycles per second and, of Part B (amber), 10,000 cycles per second, at 25 °C. The system produces strong castings, bonds and seals that are resistant to thermal cycling and shock. Its bond strength is >1500 lb/sq in., and its tensile strength is >1100 lb/sq in. The hardened compound is an...See full productRelated content from Photonics MediaPRODUCTSPhotonics Spectra January 2023 IssueVariable Gain PhotoreceiverThe OE-300 200-MHz high-speed photoreceiver from FEMTO and Electro Optical Components Inc. features quality photodiodes and a high-end, variable gain transimpedance amplifier. 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