Laser Machining of Wafers
May 2010Sydor Optics Inc.Request Info
A fast, cost-effective way to cut, edge and drill fused silica and fused quartz wafers with high precision. Through holes of various shapes, sizes and quantities with high precision for size and location. Quick turnaround with minimal fixturing requirements. Also offering a proprietary laser edge-polishing technology that enhances the mechanical resilience of wafer edges in low- to high-production volumes.