Request InfoSydor Optics Inc.A fast, cost-effective way to cut, edge and drill fused silica and fused quartz wafers with high precision. Through holes of various shapes, sizes and quantities with high precision for size and location. Quick turnaround with minimal fixturing requirements. Also offering a proprietary laser edge-polishing technology that enhances the mechanical resilience of wafer edges in low- to high-production volumes.See full productRelated content from Photonics MediaPRODUCTSPhotonics Spectra February 2023 IssueMask AlignerThe MA12 Gen3 300-mm mask aligner from SÜSS MicroTec SE combines photo lithography, microimprinting, nanoimprinting, and wafer level stacking within a compact tool. As a semi-automated...Photonics Spectra January 2024 IssuePICs Polishing PlatformThe GEO™ system from KrellTech is designed for polishing PIC optical components. 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