WaferSense Auto Gapping System
Jun 2010CyberOptics Corp.Request Info
WILSONVILLE, Ore., June 25, 2010 — CyberOptics Semiconductor Inc.’s WaferSense Auto Gapping System, the AGS300, is available in 300- and 200-mm form factors. It measures gaps that are critical to the outcome of semiconductor processes such as thin-film deposition, sputtering and etching.
Consisting of three capacitive distance sensors, the system measures the gaps between shower heads and pedestals at three points that define a plane to ensure accurate and reproducible equipment setups. Using the system, engineers can better control gap uniformity and magnitude with high stability over time.
While legacy gap measurement methods employ a wired leveling device and crush blocks that are susceptible to instrument and operator variances, the AGS 300 provides wireless measurements with first-film check rates to better than 99% accuracy. There are no wires that can break after repeated use or that will misalign as a result of the vacuum pulling on them.
The system’s waferlike design and height of only 7.5 mm enable automatic handling to speed equipment setups, maintenance and troubleshooting. The wireless method also is repeatable and gives engineers data to optimize preventive maintenance schedules and process controls.
The system measures gaps at three points with ±25-µm accuracy within four hours of field offset calibration. Gap resolution is ±5 µm.
Data can be displayed via the GapView application software on a laptop or a PC in real time so that gaps can be quickly adjusted, reducing tool calibration time. Current measurements are compared against target goals, with gap tolerances displayed in numerical and graphical forms to simplify adjustments. Readings can be logged so that the same gap is set across all tools for better tool-to-tool process uniformity.
Each graphic is color-coded to make it easier to see when the gap is above, below or within the user-defined target range.