Secured Diamond Saw Wire
Sep 2010Niabraze LLCRequest Info
High-tensile-strength fixed-grain diamond saw wire for cutting
precious, hard materials with minimal material kerf loss. Wire diameter ranging
from 140 to 350 μm for applications ranging from wafering to sampling to cropping.
Diamond concentricity and density carefully controlled to ensure efficient free
cutting. Slurry-free cutting of silicon, sapphire, quartz, germanium, SiC, ceramics
and many more materials.