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X-ray TDI Cameras

Photonics Spectra
Jun 2011
Hamamatsu CorporationRequest Info
 
Hamamatsu Corp. has added Model C10650-461 to its line of x-ray time delay integration (TDI) cameras for nondestructive inspection and testing. While maintaining high sensitivity, the “no gap” camera’s TDI technology offers higher resolution than standard line-scan cameras produce, according to the company. The camera is suitable for high-throughput inspection of printed circuit boards, electronic assemblies with ball grid arrays and other surface-mounted components, batteries and pharmaceuticals. It features a TDI CCD image sensor with 6144 x 128 pixels coupled with a CsI scintillator. Each pixel measures 48 x 48 μm, which is suitable for high-resolution imaging. The TDI line rate is 6 m/min at full resolution and 11 m/min with 2 x 2 binning. X-ray images are output as 16-bit data via a Camera Link interface.


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Americasball grid arraysBGAC10650-461Camera LinkcamerasCCDCsI scintillatorelectronic assemblieshamamatsuimagingin-line inspectionNew JerseyNew Productsnondestructive inspectionnondestructive testingpharmaceuticalsprinted circuit boardsSensors & Detectorssurface-mounted componentsTDITest & Measurementx-ray time delay integration camera

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