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Photodiode Arrays

Photonics.com
Jul 2011
Hamamatsu CorporationRequest Info
 
BRIDGEWATER, N.J., July 29, 2011 — For x-ray inspection applications, Hamamatsu Corp. has released the S11212 and S11299 series back-illuminated silicon photodiode arrays. They offer high-sensitivity uniformity across the array, as well as a robust structure. The 16-element arrays are designed with minimal variations in sensitivity between photodiode elements as well as at the sensor’s edges. The improved uniformity provides optimal x-ray images.

The back surface for coupling to the scintillator has no bonding wires or photosensitive areas, so there is less risk of damaging the photodiode array, and the output terminals are bump-bonded to the board instead of being conncted with fragile wires.

The S11212 has a package size of 25.4 × 20 mm, while the S11299’s package size is 25.4 × 10.2 mm. Both are supplied in several scintillator configurations. Sensors coupled with CsI(Tl), GOS ceramic or phosphor sheet scintillators are available. A bare-chip sensor without a scintillator is also available for those who prefer using their own.

Multiple arrays can be tiled to create a long and narrow detector for x-ray inspection. As another option, two arrays can be layered for dual-energy x-ray imaging.


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16-element photodiode arraysAmericasback-illuminated photodiode arrayshamamatsuimaginglayer two photodiode arraysNew Jerseyoutput terminals bump-bondedPDAsProductsS11212 and S11299 photodiode arraysSensors & Detectorssensors coupled with CsI(Tl)sensors coupled with GOS ceramicsensors coupled with phosphor sheet scintillatorssensors without scintillatorsilicon photodiode arraystile multiple photodiode arraysx-ray inspection applications

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