Silex Wet-Chemical Processing
KAHL AM MAIN, Germany, Aug. 9, 2011 — Singulus Technologies AG has advanced its wet-chemical batch cleaning and etching machine for silicon wafers. The core of the modified Silex system is a new isopropanol-free texturing process offering substantial cost advantages compared with traditional etching systems.
The process uses no flammable, volatile solvents and enables stable, wet-chemical texturing for silicon wafers on the basis of commercialized additives. With the application of this alkaline texturing process, the etching solution lifetime is tripled, with simultaneous shortening of the etching duration. Production costs for monocrystalline silicon solar cells are reduced.
The new generation of the machine has many advantages compared with traditional wet-chemical texturing systems. The new texturing process provides stable and reproducible results. In terms of the achieved surface quality of the silicon cells, the machine meets the high demands of the photovoltaics industry. The applied processing chemicals make waste disposal of etching solutions easier compared with traditional systems.
The new Silex system achieves an output of up to 3000 wafers per hour and is characterized by low scrap rates of <0.05% and homogeneous etching results. Wafer thickness is ~150 µm.
For more information, visit: www.singulus.de
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