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Scanning Electron Microscope

Feb 2012
Tescan USA Inc.Request Info
Tescan has unveiled the FERA3 XMH, a high-resolution Schottky field emission scanning electron microscope with an integrated plasma source focused ion beam (FIB). The system was developed in cooperation with Orsay Physics. Besides electron and ion columns, the microscope can be configured with gas injection systems, nanomanipulators, secondary electron and backscatter detectors, secondary ion detectors, cathodoluminescence detectors, and energy-dispersive and electron backscatter diffraction microanalyzers. The use of a xenon plasma source for the FIB allows the FERA3 to satisfy high-resolution FIB requirements (imaging) as well as to produce the high ion currents needed for ultrafast material removal rates. Applications include inspection of integrated circuit packaging, circuit edit, 3-D metrology, and defect and failure analysis.


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BiophotonicsBreakthroughProductsCzech RepublicEuropeFERA3 XMH scanning electron microscopemetrologyMicroscopyopticsscanning electron microscope configured with secondary electron detectorsscanning electron microscope configured with secondary ion detectorsscanning electron microscope integrated plasma source focused ion beamscanning electron microscope semiconductor packagingSchottky field emission SEMSEM 3-D metrologySEM circuit editSEM configured with backscatter detectorsSEM configured with cathodoluminescence detectorsSEM configured with electron backscatter diffraction microanalyzersSEM configured with energy-dispersive microanalyzersSEM configured with gas injection systemsSEM configured with nanomanipulatorsSEM defect analysisSEM electron and ion columnsSEM failure analysisSEM inspection of IC packagingSEM removal of large volumes of materialSensors & DetectorsTescanTest & Measurement

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