WaferSense Auto Vibration System
Jul 2012CyberOptics Corp.Request Info
WILSONVILLE, Ore., July 10, 2012 — CyberOptics Semiconductor Inc. has released a 450-mm form factor model of its AVS450 auto vibration system.
With vibration tied to semiconductor process equipment failure, low yields and cycle times, engineers need the right tools and analysis software to identify and quantify vibration sources. Random troubleshooting such as parts replacement, conducting complicated partitioned particle checks, and adjusting tool parameters in a trial-and-error method often don’t solve the problem.
The AVS450 is a wireless wafer-life vibration monitoring device that travels through the entire path of a wafer to measure vibrations of wafer transfers in X, Y and Z dimensions during semiconductor processes and fabrication and to report real-time acceleration data in three axes for engineers to identify vibration anomalies during wafer processing. It can be used to observe and optimize wafer, cassette, standard mechanical interface and front opening unified pod motions without exposing process areas to the environment.
Engineers can establish yield-based vibration standards for equipment, and technicians can identify vibration sources and set acceptable acceleration parameters for equipment. Companion vibration monitoring software allows users to set low, high and bandpass filters of equipment vibration frequencies to filter out vibrations of 20 Hz and below and monitor vibrations of 21 Hz and above to troubleshoot for vibration-related contamination. Data can be viewed and manipulated to identify problems and predict equipment failures.
The system also is available in 200- and 300-mm form factors.