Cee 1300CSX Thermal Slide Debonder
Nov 2012Brewer Science Inc.Request Info
ROLLA, Mo., Nov. 27, 2012 — Brewer Science is introducing a thermal slide debonder that enables high-temperature slide-off of thinned compound semiconductor substrates in a research-and-development or low-volume-production environment. The Cee 1300CSX features computerized process control and delivers high accuracy, interface capabilities and process flexibility.
It handles thinned compound semiconductor substrates and has separated many types of exotic wafers thinned to a thickness of <50 µm.
Features include precision lower platen z-position control, programmable electronic lift pins (loading/unloading), a compact footprint, flexible substrate sizes, a constant force mode, data logging and excess force sensing.