UV Laser Micromachining
Aug 2013IPG Photonics CorporationRequest Info
OXFORD, Mass., June 12, 2013 — The IX-255 UV laser micromachining system from IPG Photonics Corp. is a configurable multifunctional system with a beam energy density up to 25 J/cm2 for applications such as drilling and cutting ceramics, patterning of microfluidic devices and machining of low-taper-angle holes in polymers.
The fully interlocked, Class 1 workstation is built on a granite base and support structure for vibration minimization and thermal stability with dual microscope vision systems for automated part alignment and inspection. It is integrated with a proprietary UV laser and software, including macro-building tools for fast programming and generation of automating processes for complex feature machining. Additional utilities enable complex pattern input from standard CSV and DXF files.
The system can also be used in microelectronics for 3-D micromachining, glass drilling and cutting, selective material removal, and conductor trimming. In large-area exposure mode, it can be used for surface annealing applications of semiconductors, electrical connectors and biomedical devices.
An optional extended beam homogenizer is available for precise dose control, enhancing beam uniformity and doubling the system’s throughput in large-field exposure applications.