Close

Search

Search Menu
Photonics Media Photonics Buyers' Guide Photonics EDU Photonics Spectra BioPhotonics EuroPhotonics Industrial Photonics Photonics Showcase Photonics ProdSpec Photonics Handbook
More News
share
Email Facebook Twitter Google+ LinkedIn

NSX 320 Metrology System

Photonics.com
Aug 2013
Rudolph Technologies Inc.Request Info
 
FLANDERS, N.J., Aug. 7, 2013 — Rudolph Technologies Inc. has released three application-specific configurations of its NSX 320 automated macro-defect inspection system for wafer-level packaging, 2.5D interposers and 3DICs (3-D integrated circuits) using through-silicon via as interconnects.

The system measures film thickness (polymers, photoresist, glass), thin remaining silicon thickness, surface topography, and copper pillar and solder bump height. The advanced wafer-level packaging configuration adds measurements of the wafer profile (warp and bow), total stack thickness and thick/thin remaining silicon thickness (bonded wafer before and after grind).

The 3DIC configuration measures all of the above plus via and trench depth, bonded wafer total thickness variation, and adhesive layers.  


REQUEST INFO ABOUT THIS PRODUCT

* Message:
(requirements, questions for supplier)
Your contact information
* First Name:
* Last Name:
* Email Address:
* Company:
Address:
Address 2:
City:
State/Province:
Postal Code:
* Country:
Phone #:
Fax #:

Register or login to auto-populate this form:
Login Register
* Required
2.5D3DICsadhesive layersAmericasautomated macro-defect inspection systemcopper pillar heightfilm thicknessglassICsintegrated circuitsinterconnectsinterposermachine visionNew JerseyNSX 320photoresistpolymersProductsremaining silicon thicknessRudolph Technologiessolder bump heightsurface topographyTest & Measurementthrough silicon viatrench depthvia depthwafer level packaging

Terms & Conditions Privacy Policy About Us Contact Us
back to top

Facebook Twitter Instagram LinkedIn YouTube RSS
©2017 Photonics Media
x We deliver – right to your inbox. Subscribe FREE to our newsletters.
X
Are you interested in this product?
If you'd like Rudolph Technologies Inc. to reach out to you with more information about this product, please supply your email and they will contact you.

Email Address:
Stop showing me this for the remainder of my visit