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NSX 320 Metrology System
Aug 2013
Rudolph Technologies Inc.Request Info
FLANDERS, N.J., Aug. 7, 2013 — Rudolph Technologies Inc. has released three application-specific configurations of its NSX 320 automated macro-defect inspection system for wafer-level packaging, 2.5D interposers and 3DICs (3-D integrated circuits) using through-silicon via as interconnects.

The system measures film thickness (polymers, photoresist, glass), thin remaining silicon thickness, surface topography, and copper pillar and solder bump height. The advanced wafer-level packaging configuration adds measurements of the wafer profile (warp and bow), total stack thickness and thick/thin remaining silicon thickness (bonded wafer before and after grind).

The 3DIC configuration measures all of the above plus via and trench depth, bonded wafer total thickness variation, and adhesive layers.  


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A noncrystalline, inorganic mixture of various metallic oxides fused by heating with glassifiers such as silica, or boric or phosphoric oxides. Common window or bottle glass is a mixture of soda, lime and sand, melted and cast, rolled or blown to shape. Most glasses are transparent in the visible spectrum and up to about 2.5 µm in the infrared, but some are opaque such as natural obsidian; these are, nevertheless, useful as mirror blanks. Traces of some elements such as cobalt, copper and...
A chemical substance rendered insoluble by exposure to light. By means of a photoresist, a selected pattern can be imaged on a metal. The unexposed areas are washed away and are ready for etching by acid or doping to make a microcircuit.
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