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Talisker HE Series Laser

Photonics Spectra
Nov 2013
Coherent Inc.Request Info
SANTA CLARA, Calif., Sept. 6, 2013 — The Talisker HE laser series from Coherent Inc. delivers high-energy pulses to enable drilling, cutting and scribing of thick materials for applications in the automotive, biomedical, consumer electronics, mobile display and 3-D semiconductor industries.

The lasers are available with a choice of output options: 200-µJ pulse energy in the near-IR (1064 nm); 120 µJ per pulse in the green (532 nm); or 40-µJ pulse energy in the UV (355 nm).

Their high-energy picosecond pulses extend the optical depth of the focused beam so that cold ablation occurs throughout the full thickness of the target material, eliminating thermal debris.

The higher-energy pulses are used in various materials processing techniques: single-shot pulses replace percussively drilled holes; very thick materials are drilled with reduced taper; and engraving and trepanning benefit from deeper, high-aspect-ratio structuring.


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The process of forming a lens to a given pattern, or of cutting a piece of glass along the line of scratch.
The process of perforating a silicon or ceramic substrate with a series of tiny holes along which it will break. Nd:YAG or CO2 lasers are now routinely used.
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