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3-D Optical Microscope

BioPhotonics
Apr 2014
Bruker Nano SurfacesRequest Info
 
TUCSON, Ariz., Dec. 17, 2013 — Bruker Corp. has launched the ContourSP, a large-panel 3-D metrology system for gauging individual layers of printed circuit board (PCB) panels during manufacturing.

Based on white-light interferometry, the technology is designed to enable minimum recipe development time, maximum uptime, and increased measurement throughput of high-density interconnect substrates in multichip modules.

The system features the proprietary Vision64 operating and analysis software.


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3-D metrologyAmericasArizonabiophotonicsBrukerContourSPhigh-density interconnectindustrialmachine visionmetrologyMicroscopymultichip moduleopticsPCB manufacturingprinted circuit boardsProductssemiconductorTest & MeasurementVision64

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