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UV Boards

Industrial Photonics
Jul 2014
Innovations in Optics Inc.Request Info
WOBURN, Mass., April 30, 2014 — LumiBright UV Boards from Innovations in Optics offer maximized heat, current spreading and open platform flexibility for high-power UV LED applications.

LumiBright UV Boards feature a large emitting area and a closely packed array of UV LED chips from chip-on-board LED technology with metallic core PCB substrates. Standard wavelengths include 365, 385, 395 and 405 nm.

The 1.1-mm2 LED die can be PCB mounted as a single chip or an array. Each die can be driven to emit 2 W/mm2, with a 16-die array supplying 40 W of power.

The boards release directly into the air with no epoxy or lens encapsulation. Light extraction provides a Lambertian far-field distribution pattern to support optical design flexibility. Custom configurations are offered with a small footprint.


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Common name for a variety of adhesives used for lens bonding, fiber optic splicing and other photonics applications. The term is actually a prefix denoting the presence of an epoxide group in a molecule.
1. The sector of the Earth's surface registered upon a remote sensing device in a satellite. 2. The amount of space occupied by a component on the surface upon which it is mounted. 3. The space on an optical component occupied by a light beam.
Obeying Lambert's cosine law.
Pertaining to optics and the phenomena of light.
A device that determines the lens shape in the cutting or edging phase of fabrication. It also is used to denote the arrangement of markings on a reticle.
With respect to a lens, the reciprocal of its focal length. The term power, as applied to a telescope or microscope, often is used as an abbreviation for magnifying power.
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