Techspec Fused Silica Wafers
Jul 2014Edmund Optics Inc.Request Info
BARRINGTON, N.J., July 25, 2014 — With less than 10-Å surface roughness, Techspec Fused Silica Wafers from Edmund Optics can be used as test substrates for measuring optical coating quality.
The thin, circular pieces of UV-fused silica provide 40-20 surface quality with RoHS compliancy. All wafers have thicknesses of 1 mm and a transmission range of 0.2 to 2.2 µm.
Techspec wafers are ultrasonically cleaned and can also be used in semiconductor microlithography, micro-electrical-optical applications or set-up processes as dummy components.