Search
Menu
DataRay Inc. - ISO 11146-Compliant Laser Beam Profilers

Techspec Fused Silica Wafers

Edmund Optics Inc.Request Info
 
Facebook X LinkedIn Email
BARRINGTON, N.J., July 25, 2014 — With less than 10-Å surface roughness, Techspec Fused Silica Wafers from Edmund Optics can be used as test substrates for measuring optical coating quality.

The thin, circular pieces of UV-fused silica provide 40-20 surface quality with RoHS compliancy. All wafers have thicknesses of 1 mm and a transmission range of 0.2 to 2.2 µm.

Techspec wafers are ultrasonically cleaned and can also be used in semiconductor microlithography, micro-electrical-optical applications or set-up processes as dummy components.


Published: July 2014
REQUEST INFO ABOUT THIS PRODUCT
* First Name:
* Last Name:
* Email Address:
* Company:
* Country:
Message:


When you click "Send Request", we will record and send your personal contact information to Edmund Optics Inc. by email so they may respond directly. You also agree that Photonics Media may contact you with information related to this inquiry, and that you have read and accept our Privacy Policy and Terms and Conditions of Use.

Register or login to auto-populate this form:
Login Register
* Required

Photonics Marketplace
Looking for Substrates? There are 54 companies listed in the Photonics Buyers' Guide.
Browse Cameras & Imaging, Lasers, Optical Components, Test & Measurement, and more.
industrialAmericasapplicationCoatingscomponentEdmund OpticselectricalfusedMaterialsmicromicrolithographyNew JerseyopticalOpticsqualityRoHSroughnesssemiconductorssilicasubstratesurfaceTechspecTest & MeasurementthicknesstransmissionultrasonicUVWafersprocessesBarringtoncleaneddummyset-up

We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.