Search Menu
Photonics Media Photonics Buyers' Guide Photonics EDU Photonics Spectra BioPhotonics EuroPhotonics Industrial Photonics Photonics Showcase Photonics ProdSpec Photonics Handbook
More News
Email Facebook Twitter Google+ LinkedIn

Thickness Analysis System

Industrial Photonics
Jan 2015
Advantest America Inc.Request Info
TOKYO — Based on advances in terahertz technology, the TS9000 from Advantest nondestructively measures the thickness of semiconductor packaging.

The TS9000 enables rapid, repeatable and accurate measurements of mold thickness without the limitations of existing measurement methods. It can be deployed at various points in the assembly and packaging process, even immediately after the curing process, enabling easier detection of production issues in high-volume manufacturing.

Terahertz radiation is used to penetrate into many materials, including ceramics, silicon and plastic polymers, even if the materials are optically opaque. This allows for nondestructive layer thickness measurement in a wide variety of materials.

Rapid fiber-coupled pulsed laser generation enables speed, accuracy and throughput suitable for a high-volume manufacturing environment.


* Message:
(requirements, questions for supplier)
Your contact information
* First Name:
* Last Name:
* Email Address:
* Company:
Address 2:
Postal Code:
* Country:
Phone #:
Fax #:

Register or login to auto-populate this form:
Login Register
* Required
Asia-Pacificpulsed lasersimagingindustriallasersmaterialsopticsProductsTest & Measurement

Terms & Conditions Privacy Policy About Us Contact Us
back to top

Facebook Twitter Instagram LinkedIn YouTube RSS
©2018 Photonics Media
x Subscribe to Industrial Photonics magazine - FREE!
Are you interested in this product?
If you'd like Advantest America Inc. to reach out to you with more information about this product, please supply your email and they will contact you.

Email Address:
Stop showing me this for the remainder of my visit