Laser Diode Packages
Mar 2015SCHOTT North America Inc.Request Info
ELMSFORD, N.Y., March 19, 2015 — Transistor outline (TO) packages from Schott North America Inc. are suited for 10-Gb/s laser diodes in high-frequency, actively cooled communications applications.
The TEC TO package features a thermoelectric cooler that allows for controlled heat dissipation, which leads to regulated and stable laser wavelengths.
Since the package is based on a TO footprint, it is also reduced in size compared to the conventional box packages.
The new design is also based on an extended radio-frequency feedthrough, which boasts shortened wire bonds to minimize signal losses to the laser diode, improving the overall performance.