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Process Carriers

EuroPhotonics
Dec 2015
Plan Optik AGRequest Info
 
ELSOFF, Germany — Plan Optik AG has expanded its range of carriers for the handling of semiconductor wafers and substrates of nonstandard shapes and sizes for processes related to semiconductors and microelectromechanical systems (MEMS).

The process carriers consist of either surface-processed silicon wafers or a combination of a blank silicon wafer with a bonded glass carrier on top. They are available in many combinations (300 to 200 mm, 200 to 150 mm, etc.) and can also accommodate multiple small substrates (e.g. four 3-in. wafers on one 200-mm carrier, or hundreds of smaller sizes such as 10 × 10-mm substrates).

High temperature and chemical resistance, low tolerances and thermal expansion adjusted to silicon or other substrate materials are available. The company offers double-sided polishing and laser marking, including QR codes for process tracing, making the carriers reusable. 


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