Oct 2015Dantec Dynamics GmbHRequest Info
ULM, Germany, Oct. 28, 2015 — Dantec Dynamics GmbH has announced the μDIC all-in-one microscopic measurement system for industries that require submicron tolerances on warpage and thermal expansion.
The system is based on digital image correlation (DIC), an optical, real-time, noncontact measurement technique. Designed as a turnkey system, the device includes a stereomicroscope, illumination, a heating and cooling stage, 5-MP cameras and measurement software.
The system provides full-field, 3D deformation and strain analysis. The results include complete shape, deformation and strain data that can be represented in temporal and spatial plots, virtual strain data gauges, STL files, and images.