Nov 2015Flip Chip Opto Inc.Request Info
FREMONT, Calif., Nov. 11, 2015 — Flip Chip Opto Inc. has announced the Apollo 1200 chip-on-board (COB) LED module.
Based on 3-Pad LED flip chip and Pillar MCPCB (metal core printed circuit board) technologies, both junction temperature and thermal decay are minimized due to 0.006 °C/W thermal resistance, allowing more than 120,000 lumens to be emitted from a single module. The modules enable energy-efficient LED technology to replace metal halide lamps in high-power lighting applications such as high masts, stadiums, airports, shipping terminals, maritime settings and more.
3-Pad technology creates an extra thermal pad beside two electrode pads, coupling the heat directly from the LED into the metal core of the underlying MCPCB. This enables brighter output, less thermal decay, longer service life and coordination with a smaller heatsink.