NASA Low Outgassing Epoxy

Master Bond Inc.

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Serviceable from 275°F to 4K, two-component Master Bond EP29LPSP for bonding, sealing, coating, potting and casting is NASA low outgassing approved. It is capable of withstanding cryogenic shocks (room temperature to liquid helium in a 5 to 10 minute time period). It has an advantageous low mixed viscosity of 500-1,5—cps and is frequently employed in potting/casting applications. Electrical insulation properties are outstanding. Volume resistivity is greater than 1015 ohm cm. EP29LPSP is solvent free and ROHS compliant. Bond strength to metals, glass, ceramics, composites, rubber and most plastics is excellent. It also features optical clarity, superb chemical resistance, low exotherm, a Shore D hardness greater than 65 and tensile strength greater than 8,000 psi. Working life for a 100 gram mass is 4 to 5 hours at room temperature. Its mix ratio is 100 to 65 by weight. EP29LPSP will gel at ambient temperature. It will cure at 175°F in 5 to 7 hours or 3 to 5 hours at 200°F. This epoxy is vacuum compatible and can be used in both ambient and cryogenic environments.

Typical ambient type applications include thin film heads, mass spectrometers, x-ray analysis, surface analysis, MEMS, and semiconductor process equipment. Cryogenic applications include satellite tracking systems, infrared detectors, cryogenic pumps, optical windows, dilution and refrigeration units, and chromatography.

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Published: December 2015