Request InfoSaki Corp.Saki Corp. has added the BF-3Di-Z and BF-3Di-D models to its line of 3D automated optical inspection systems. The systems provide measurements of printed circuit board components with a height range of 0 to 20 mm, achieving 1-μm height resolution and a false-call rate of less than 100 ppm with 0 escapes. The camera and lighting systems capture clear, detailed images with no shadowing for inspection of difficult defects such as lifted leads, tombstones, reverses and height variations. The BF-3Di-D model accommodates dual lanes, and BF-3Di-Z offers an extra-large platform.See full productRelated content from Photonics MediaPRODUCTSPhotonics.com 8/23/20233D Solder Paste Inspection SolutionThe TR7007Q SII from Test Research Inc. is a high-performance 3D solder paste inspection system designed to enhance production efficiency in the electronics manufacturing industry. 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