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Microassembly Platform
Mar 2016
FinetechRequest Info
GILBERT, Ariz., March 15, 2016 — Microassembly PlatformFinetech USA’s FINEPLACER femto 2 die-bonding platform is designed for advanced packaging and bonding in automated precision manufacturing, with a focus on high yield.

With a placement accuracy of ± 0.5 μm at three sigma and maximum process flexibility, the machine supports a wide range of applications at chip and wafer level. The prototype-to-production system accommodates applications that migrate from process and product development to automated low-volume production environments.

The platform accommodates optoelectronics, semiconductors, silicon photonics, medical engineering, sensor production and R&D. High-quality dispensing options allow lines, dots and patterns, as well as micro dipping solutions for smallest components and contact areas.


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A sub-field of photonics that pertains to an electronic device that responds to optical power, emits or modifies optical radiation, or utilizes optical radiation for its internal operation. Any device that functions as an electrical-to-optical or optical-to-electrical transducer. Electro-optic often is used erroneously as a synonym.
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